Combined MOSFET and Schottky Diode Increases Current Handling and Cuts Losses
Combining packaging advances that
boost current-handling capabilitywith
lowon-resistance and low reverse-recovery
charge, theVishay SiE726DF
SkyFET™ improves the efficiency of high-current
power-control circuits.
The SiE726DF combines a 30V N-channel
power MOSFET with an integrated Schottky
diode. Its encapsulated PolarPAK® package
has thermal resistance of 1°C/W and has an
exposed top for effective cooling to both
surfaces, both sides. These thermal
enhancements enable 50% higher current-handling
capability compared to a standard
SO-8 device, within the same footprint.
Maximum rated current is package-limited to
60A, and with low on-resistance of 2.4mΩ
the SiE726DF minimises losses when passing
high currents.
The characteristics of the Schottky diode
and MOSFET parasitic diode are also
optimised for higher overall
efficiency, with overall reverse-recovery
charge of 30nC and
source-drain voltage of 0.37V
helping to reduce power
losses compared to a standard
MOSFET. Moreover, these
savings increase with higher
switching frequency.
Implementing the external
Schottky diode inside the
package allows designers
to create smaller, more
compact circuit designs
while reducing costs.
FEATURES
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- Encapsulated, non-exposed die
- Shoot-through resistant design
- Heatsink-free operation
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APPLICATIONS
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- High-current synchronous rectification
- Voltage-Regulator Modules (VRM)
- POL converters
- Systems with forced-air cooling
- Graphics cards
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Top and bottom heat-dissipation paths enable
high performance in systems with forced-air cooling.