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Low-Ohmic Switches Enable Condensed Design



 


The combination of low on-resistance and accurate resistance flatness provided by NXP’s NX3 low-ohmic analogue switches greatly reduces switched signal attenuation and distortion. This eliminates the need for buffer amplifiers inmany applications, andmakes the NX3 family suitable for audio andmixed-signal systems in small, portable devices.

The compact MicroPak™ package greatly improves placement and routing, so that the switches are easier to place in applications where board space and headroom are at a premium.

The low-switching threshold levels of the NX3xxT low-ohmic switches supports interfacing with ASICs and other circuits that require switching-level translation. When switching 2V audio signals to a 32W speaker, the NX3L series has a typical attenuation of 0.13dB and typical distortion of 0.024% at a supply voltage of 2.7V. Under the same conditions the NX3V series has a typical attenuation of 0.07dB and distortion of 0.01%.

Due to its low on-resistance and high continuous-current capability of 350mA, the NX3V series is also suitable for use in power-management applications.

The switches are fabricated using a 0.35µm CMOS technology that reduces both static and dynamic power dissipation. A wide supply voltage range of 1.4V to 4.3V, combined with low leakage, low power consumption and low switch leakage of 50nA also makes the NX3 family ideal for portable devices and monitoring applications.

To make the NX3 family tolerant to slower input rise and fall times the inputs contain a Schmitt-trigger action.

Additionally, to support mixed-voltage switch applications, the NX3xxT products have control pins with a low-threshold input level. This allows a 1.8V controller to drive a 3.3V switch without any external translator devices.

 

FEATURES
  • Low on-resistance
  • 0.1Ω typical on-resistance flatness
  • Supply voltage range: 1.4V to 4.3V
  • 350mA continuous-current capability
  • <50nA leakage current at 85°C
  • Break-before-make switching
  • 7.5kV Human-Body Model (HBM) ESD performance
  • Operating temperature ranges:
    -40°C to 85°C or -40°C to 125°C
APPLICATIONS
  • Portable instrumentation
  • Small, portable devices

 


The compact MicroPak package enables designs where PCB space is at a premium.

 

  NXP / NX3 family

 

 

 

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